The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Nov. 28, 2019
Applicant:

Shoei Chemical Inc., Tokyo, JP;

Inventors:

Kousuke Nishimura, Tosu, JP;

Naoto Shindo, Tosu, JP;

Hiroshi Mashima, Tosu, JP;

Yuji Akimoto, Tosu, JP;

Assignee:

SHOEI CHEMICAL INC., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); B22F 1/107 (2022.01); C09D 11/033 (2014.01); C09D 11/037 (2014.01); C09D 11/14 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); B22F 1/107 (2022.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/14 (2013.01); H01B 1/22 (2013.01); B22F 2301/255 (2013.01); B22F 2304/10 (2013.01);
Abstract

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, wherein the silver powder contains a first silver powder having a D50 of 3.50 to 7.50 μm and a second silver powder having a D50 of 0.80 to 2.00 μm, where D50 represents a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement; a copper content of the whole silver powder is 10 to 5000 ppm by mass; a copper content of the second silver powder is 80 ppm by mass or more; and the first silver powder contains substantially no copper. The present invention provides a silver paste containing a powder in a high concentration and excellent in printability, and provides a silver conductor film that has a high filling factor, a high film density, high electrical conductivity, and excellent migration resistance.


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