The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Sep. 25, 2014
Lg Chem, Ltd., Seoul, KR;
Hwa Yeon Moon, Daejeon, KR;
Jung Jin Shim, Daejeon, KR;
Hee Yong Shim, Daejeon, KR;
Hyun Sung Min, Daejeon, KR;
Mi Seon Kim, Daejeon, KR;
Chang Bo Shim, Daejeon, KR;
LG CHEM, LTD., Seoul, KR;
Abstract
There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.