The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Feb. 27, 2018
Applicant:

Hangzhou Gaoxi Technology Co., Ltd., Hangzhou, CN;

Inventors:

Chao Gao, Hangzhou, CN;

Yan Guo, Hangzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/00 (2006.01); B32B 9/00 (2006.01); B32B 27/00 (2006.01); B32B 37/00 (2006.01); B32B 38/00 (2006.01); C04B 35/524 (2006.01); B32B 9/04 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 37/02 (2006.01); B32B 37/10 (2006.01); C04B 35/626 (2006.01); C04B 35/645 (2006.01); B32B 37/06 (2006.01); B32B 37/24 (2006.01);
U.S. Cl.
CPC ...
C04B 35/524 (2013.01); B32B 9/04 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 37/02 (2013.01); B32B 37/06 (2013.01); B32B 37/1018 (2013.01); B32B 38/0008 (2013.01); C04B 35/6264 (2013.01); C04B 35/62655 (2013.01); C04B 35/62665 (2013.01); C04B 35/645 (2013.01); B32B 2037/243 (2013.01); B32B 2307/302 (2013.01); B32B 2309/025 (2013.01); B32B 2309/125 (2013.01); B32B 2309/68 (2013.01); B32B 2310/0472 (2013.01); B32B 2310/14 (2013.01); B32B 2313/04 (2013.01); B32B 2379/08 (2013.01); C04B 2235/422 (2013.01); C04B 2235/425 (2013.01); C04B 2235/48 (2013.01); C04B 2235/606 (2013.01); C04B 2235/658 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/661 (2013.01); C04B 2235/781 (2013.01); C04B 2235/9607 (2013.01);
Abstract

The present invention discloses a polyimide-based composite carbon film with high thermal conductivity and a preparation method therefor. The preparation method includes: uniformly coating the surface of a polyimide-based carbon film with an aqueous graphene oxide solution, and then covering the same with another polyimide-based carbon film uniformly coated with an aqueous graphene oxide solution; repeating such operation; after the polyimide-based carbon films are dried, bonding the polyimide-based carbon films by means of graphene oxide so as to form a thick film; bonding the polyimide-based carbon films more tightly by means of further low-temperature hot pressing; and finally, obtaining a thick polyimide-based carbon film with high thermal conductivity by repairing defects by means of low-temperature heating pre-reduction and high-temperature and high-pressure thermal treatment. The thick polyimide-based carbon film with high thermal conductivity has a thickness greater than 100 μm and an in-plane thermal conductivity of even reaching 1700 W/mK or above.


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