The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Nov. 29, 2018
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Eiji Okamoto, Matsumoto, JP;

Akihiko Tsunoya, Okaya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B29C 64/153 (2017.01); B29C 64/209 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B22F 3/10 (2006.01); B29C 64/194 (2017.01); B22F 10/10 (2021.01); B33Y 70/00 (2020.01); B29C 64/336 (2017.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B22F 3/1007 (2013.01); B22F 10/10 (2021.01); B29C 64/153 (2017.08); B29C 64/194 (2017.08); B29C 64/209 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B22F 3/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B29C 64/336 (2017.08); B33Y 70/00 (2014.12);
Abstract

Provided is a method which includes a first layer formation step of forming a first layer by using a first composition that contains a constituent material powder, a first powder, and a binder of a three-dimensional shaped article; a second layer formation step of forming a second layer by using a second composition that contains a second powder and a binder; a degreasing step of a stack containing the first layer and the second layer; and a sintering step of the stack, a decomposition point of the first powder is higher than decomposition points of the binder of the first layer and the binder of the second layer, a decomposition point of the second powder is higher than the decomposition point of the first powder, and a sintering temperature of the constituent material powder is higher than the decomposition point of the second powder.


Find Patent Forward Citations

Loading…