The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Dec. 09, 2016
Applicant:
The Hong Kong University of Science and Technology, Hong Kong, CN;
Inventors:
George Alexandru Tilita, Hong Kong, CN;
Wenhao Chen, Hong Kong, CN;
Chi Fong Kwan, Hong Kong, CN;
Matthew Ming Fai Yuen, Hong Kong, CN;
Assignee:
THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY, Hong Kong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/264 (2017.01); G06F 30/00 (2020.01); B22F 12/00 (2021.01); B22F 10/20 (2021.01); B33Y 70/00 (2020.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B22F 10/20 (2021.01); B22F 12/00 (2021.01); B29C 64/264 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); G06F 30/00 (2020.01); B22F 10/10 (2021.01); B22F 2999/00 (2013.01); Y02P 10/25 (2015.11);
Abstract
Embodiments disclosed herein represent powder based additive manufacturing processes which provide a microstructure having improved mechanical properties. The methods may include the use of ultrasonic excitation in combination with the active control of a substrate's temperature to provide some level of control over the microstructure and hence the properties.