The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Apr. 26, 2019
Applicant:

Skc Solmics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Sunghoon Yun, Gyeonggi-do, KR;

Jang Won Seo, Busan, KR;

Hye Young Heo, Gyeonggi-do, KR;

Jong Wook Yun, Gyeonggi-do, KR;

Jaein Ahn, Gyeonggi-do, KR;

Su Young Moon, Gyeonggi-do, KR;

Assignee:

SKC solmics Co., Ltd., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/26 (2012.01); B24B 37/22 (2012.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 37/22 (2013.01);
Abstract

Provided is a polishing pad that comprises a plurality of first grooves that have a shape of geometric figures that share a center; and a plurality of second grooves that radially extend from the center to the outer perimeter, wherein the depth of the second grooves is equal to, or deeper than, the depth of the first grooves. It is possible for the polishing pad to rapidly discharge any debris generated during the polishing process to reduce such defects as scratches on the surface of a wafer.


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