The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Mar. 02, 2020
Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Mikiya Sakashita, Nagoya Aichi, JP;
Yukiteru Matsui, Nagoya Aichi, JP;
Akifumi Gawase, Kuwana Mie, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); B24B 37/042 (2013.01); H01L 21/30625 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01);
Abstract
According to one embodiment, a polishing apparatus includes a holder for holding a polishing pad for polishing a surface of a substrate. A plurality of pressing members are configured to press a back surface side of the polishing pad while held by the holder. A driving unit is configured to selectively move pressing members in a direction towards the surface of the substrate so as to press the back surface side of the polishing pad.