The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Jul. 08, 2021
Applicant:
Powdermet, Inc., Euclid, OH (US);
Inventors:
Mark Grogan, Cleveland, OH (US);
Brian Doud, Cleveland Heights, OH (US);
Andrew Sherman, Mentor, OH (US);
Assignee:
POWDERMET, INC., Euclid, OH (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/17 (2022.01); B23H 5/12 (2006.01); B22F 3/24 (2006.01); C04B 35/58 (2006.01); C04B 35/56 (2006.01); B23P 13/02 (2006.01); B23H 7/00 (2006.01); B23H 1/08 (2006.01); B23H 5/04 (2006.01); B22F 3/105 (2006.01); B22F 3/14 (2006.01); B22F 3/15 (2006.01); B22F 3/17 (2006.01); B22F 3/18 (2006.01); B22F 3/20 (2006.01); C22C 29/00 (2006.01); C22C 32/00 (2006.01); C22C 29/06 (2006.01); C22C 29/08 (2006.01); C22C 29/14 (2006.01); F16C 33/00 (2006.01); F16C 17/00 (2006.01); F16C 19/00 (2006.01); F16C 33/04 (2006.01);
U.S. Cl.
CPC ...
B23H 5/12 (2013.01); B22F 1/17 (2022.01); B22F 3/105 (2013.01); B22F 3/14 (2013.01); B22F 3/15 (2013.01); B22F 3/17 (2013.01); B22F 3/18 (2013.01); B22F 3/20 (2013.01); B22F 3/24 (2013.01); B23H 1/08 (2013.01); B23H 5/04 (2013.01); B23H 7/00 (2013.01); B23P 13/02 (2013.01); C04B 35/5626 (2013.01); C04B 35/58014 (2013.01); C22C 29/00 (2013.01); C22C 29/005 (2013.01); C22C 29/065 (2013.01); C22C 29/08 (2013.01); C22C 29/14 (2013.01); C22C 32/00 (2013.01); F16C 33/00 (2013.01); F16C 17/00 (2013.01); F16C 19/00 (2013.01); F16C 33/043 (2013.01); F16C 2206/80 (2013.01);
Abstract
A heterogeneous composite consisting of near-nano ceramic clusters dispersed within a ductile matrix. The composite is formed through the high temperature compaction of a starting powder consisting of a core of ceramic nanoparticles held together with metallic binder. This core is clad with a ductile metal such that when the final powder is consolidated, the ductile metal forms a tough, near-zero contiguity matrix. The material is consolidated using any means that will maintain its heterogeneous structure.