The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Mar. 16, 2021
Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventors:

Kuniharu Yamada, Kanagawa, JP;

Kohei Matsuura, Kanagawa, JP;

Assignee:

Sodick Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/41 (2006.01); B23H 1/02 (2006.01);
U.S. Cl.
CPC ...
B23H 1/02 (2013.01); G05B 19/41 (2013.01); B23H 2600/12 (2013.01); G05B 2219/45221 (2013.01);
Abstract

To automatically change and set machining conditions suitable for a plate thickness even when machining paths of a rough machining step and an end surface finishing step are different in level difference machining in which the plate thickness changes during machining. In a wire electric discharge machining method and a wire electric discharge machining apparatus of the disclosure, an XY-plane of a workpiece stand is divided into small regions to form a plurality of divided regions, and a plate thickness of the workpiece is detected and stored in association with the divided regions. Thereafter, whether there is a level difference ahead of a traveling direction of a machining path is estimated according to plate thickness information associated with the divided regions and a plate thickness of the workpiece at a current machining position, and machining conditions are changed.


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