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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11534824 B1

PDFFull Text
Date of Patent:
Dec. 27, 2022

Filed:

Apr. 19, 2018

Composition

Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Vladek Kasperchik, Corvallis, OR (US);

Mohammed S. Shaarawi, Corvallis, OR (US);

James McKinnell, Corvallis, OR (US);

Michael G. Monroe, Corvallis, OR (US);

Jason Hower, Corvallis, OR (US);

Assignee:

Hewlett-Packard Development Company, L.P., Spring, TX (US);

Attorney:

Dierker & Kavanaugh PC

Primary Examiner:

Colin W Slifka

Int. Cl.
CPC ...
B22F 1/10 (2022.01); B33Y 10/00 (2015.01); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); B22F 10/10 (2021.01); C08F 2/22 (2006.01); C08F 212/08 (2006.01); C08F 220/14 (2006.01); C09D 11/037 (2014.01); C09D 11/322 (2014.01); C09D 11/38 (2014.01); B33Y 70/00 (2020.01); B29C 64/165 (2017.01); B22F 10/14 (2021.01); C08K 3/11 (2018.01); B22F 1/05 (2022.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 10/73 (2021.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B22F 1/10 (2022.01); B22F 1/05 (2022.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 10/10 (2021.01); B22F 10/14 (2021.01); B22F 10/73 (2021.01); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); C08F 2/22 (2013.01); C08F 212/08 (2013.01); C08F 220/14 (2013.01); C08K 3/11 (2018.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); C09D 11/38 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B82Y 30/00 (2013.01);
Abstract

An example of a composition includes a host metal present in an amount ranging from about 95.00 weight percent to about 99.99 weight percent, based on a total weight of the composition. A flow additive is present in an amount ranging from about 0.01 weight percent to about 5.00 weight percent, based on the total weight of the composition. The flow additive consists of a metal containing compound that is reducible to an elemental metal in a reducing environment at a reducing temperature less than or equal to a sintering temperature of the host metal. The elemental metal is capable of being incorporated into a bulk metal phase of the host metal in a final metal object. The composition is spreadable, having a Hausner Ratio less than 1.25.

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