The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Feb. 07, 2020
Applicant:

Ovh, Roubaix, FR;

Inventors:

Christophe Maurice Thibaut, Houplin Ancoisne, FR;

Patrick-Gilles Maillot, Marsanne, FR;

Henryk Klaba, Roubaix, FR;

Assignee:

OVH, Roubaix, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/406 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20836 (2013.01); G05B 19/406 (2013.01); H05K 7/20154 (2013.01); H05K 7/20209 (2013.01); H05K 7/20336 (2013.01); H05K 7/20736 (2013.01); H05K 7/20818 (2013.01); G05B 2219/49219 (2013.01);
Abstract

A cooling arrangement for an electronic device comprises a primary cooling device and a secondary cooling device. The primary cooling device includes a fluidic input line receiving a cooling fluid from a cooling fluid source and a fluidic output line returning the cooling fluid toward a drain. The primary cooling device is thermally connected to the electronic device, receives the cooling fluid from the fluidic input line and transfers heat from the electronic device to the cooling fluid before returning the cooling fluid via the fluidic output line. A flow detection device monitors a flow of the cooling fluid in the primary cooling device. The secondary cooling device is thermally connected to the electronic device. A processor activates the secondary cooling device to absorb and dissipate heat from the electronic device when the flow detection device detects a lack of flow of the cooling fluid in the primary cooling device.


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