The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Dec. 08, 2020
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Douglas Patrick Kelley, Sammamish, WA (US);
James Anthony Fikse, Bellevue, WA (US);
Alexis Grace Schubert, Seattle, WA (US);
Kathryn Midori Oseen-Senda, Seattle, WA (US);
Martin B. Christiansen, Laurel, MD (US);
Matthew David Turner, Seattle, WA (US);
Microsoft Technology Licensing, LLC, Redmond, WA (US);
Abstract
Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.