The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Nov. 01, 2021
Applicant:

Audi Ag, Ingolstadt, DE;

Inventor:

Thomas Ferstl, Ingolstadt, DE;

Assignee:

Audi AG, Ingolstadt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0207 (2013.01); H05K 2201/064 (2013.01);
Abstract

An arrangement for exchanging heat between two bodies comprises a circuit board, having at least one first via and at least one second via, wherein at least one heat exchange structure is integrated in the circuit board, wherein the at least one heat exchange structure comprises two heat exchange layers and an intermediate layer arranged between the two heat exchange layers, wherein the two heat exchange layers are thermally joined to each other and electrically separated from each other by the intermediate layer, wherein a first heat exchange layer is associated with the first body and can be brought into thermal contact with it and a second heat exchange layer is associated with the second body and can be brought into thermal contact with it, wherein the at least one first via and the at least one second via are each led through the two heat exchange layers and the intermediate layer arranged between the two heat exchange layers, wherein the at least one first via is in contact only with the first heat exchange layer and is insulated from the second heat exchange layer, and wherein the at least one second via is in contact only with the second heat exchange layer and is insulated from the first heat exchange layer.


Find Patent Forward Citations

Ferstl, Thomas. (2022). Arrangement for heat exchange (U.S. Patent No. 11533803). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11533803

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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