The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Jul. 18, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Mauro Cimino, Santa Clara, CA (US);

Don Channa Kaluarachchi, Santa Clara, CA (US);

Son Phi, Santa Clara, CA (US);

Ramyashree Vishnuprasad, Santa Clara, CA (US);

Dmitry Lubomirsky, Cupertino, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); H05B 1/02 (2006.01); G01K 7/18 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H05B 1/0233 (2013.01); G01K 7/183 (2013.01); H01J 37/32724 (2013.01); H01L 21/67248 (2013.01); H01J 2237/334 (2013.01);
Abstract

A plurality of heating zones in a substrate support assembly in a chamber is independently controlled. Temperature feedback from a plurality of temperature detectors is provided as a first input to a process control algorithm, which may be a closed-loop algorithm. A second input to the process control algorithm is targeted values of heater temperature for one or more heating zones, as calculated using a model. Targeted values of heater power needed for achieving the targeted values of heater temperature for the one or more heating zones is calculated. Chamber hardware is controlled to match the targeted value of heater temperature that is correlated with the wafer characteristics corresponding to the current optimum values of the one or more process parameters.


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