The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Dec. 30, 2020
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Yu Hui, Irvine, CA (US);

Guofeng Chen, Freemont, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/02 (2006.01); B81B 3/00 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
H04R 17/02 (2013.01); B81B 3/0021 (2013.01); H01L 41/0973 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer being substantially flat with substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.


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