The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

May. 21, 2018
Applicants:

Howmedica Osteonics Corp., Mahwah, NJ (US);

The University of Liverpool, Liverpool, GB;

Inventors:

Christopher J. Sutcliffe, Liverpool, GB;

Rebecca Helen Garrard, Moseley, GB;

Eric Jones, Limerick, IE;

Lewis Mullen, Englewood, NJ (US);

Hay Wong, Liverpool, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B22F 10/20 (2021.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); B29C 64/153 (2017.01); H01L 31/0216 (2014.01); H02S 40/22 (2014.01);
U.S. Cl.
CPC ...
H01L 31/02167 (2013.01); B22F 10/20 (2021.01); B33Y 10/00 (2014.12); H01L 31/02164 (2013.01); H02S 40/22 (2014.12); B22F 2999/00 (2013.01); B29C 64/153 (2017.08); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

A High Energy Beam Processing (HEBP) system provides feedback signal monitoring and feedback control for the improvement of process repeatability and three-dimensional (3D) printed part quality. Signals reflecting process parameters and the quality of the fabricated parts are analyzed by monitoring feedback signals from artifact sources with a process controller which adjusts process parameters. In this manner, fabricated parts are produced more accurately and consistently from powder feedstock by compensating for process variation in response to feedback signals.


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