The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
May. 08, 2020
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
David C. Zhang, Milpitas, CA (US);
Pranav Balachander, Santa Clara, CA (US);
Assignee:
Western Digital Technologies, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/5226 (2013.01); H01L 23/5383 (2013.01); H01L 23/66 (2013.01); H05K 1/0243 (2013.01); H01L 2224/49174 (2013.01);
Abstract
An apparatus is provided that includes a die stack having a first die and a second die disposed above a substrate, and a capacitor die disposed in the die stack between the first die and the second die. The capacitor die includes a plurality of integrated circuit capacitors that are configured to be selectively coupled together to form a desired capacitor value coupled to at least one of the first die and the second die.