The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Sep. 02, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Jun Iijima, Yokkaichi, JP;

Hiroshi Nakaki, Yokkaichi, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/14 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 21/78 (2013.01); H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/2762 (2013.01); H01L 2224/27614 (2013.01); H01L 2224/27845 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/29194 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/83896 (2013.01); H01L 2224/92142 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/14511 (2013.01);
Abstract

In one embodiment, a semiconductor wafer includes a first substrate, a first insulator provided on the first substrate, and a plurality of first pads provided in the first insulator. The wafer further includes a second insulator provided on the first insulator, a plurality of second pads provided on the first pads in the second insulator, a stacked film alternately including a plurality of first insulating layers and a plurality of second insulating layers provided in the second insulator, and a second substrate provided on the second insulator. Furthermore, the first insulator and the second insulator are connected to each other between an edge face of the first insulator and an edge face of the second insulator, and the second insulator intervenes between the first insulator and the stacked film at the edge faces of the first and second insulators.


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