The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Jun. 24, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Yoo Rim Cha, Suwon-si, KR;
Joo Hwan Jung, Suwon-si, KR;
Jung Chul Gong, Suwon-si, KR;
Yong Ho Baek, Suwon-si, KR;
Young Sik Hur, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01L 23/642 (2013.01);
Abstract
A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.