The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Dec. 28, 2020
Applicant:

Xi'an Jiaotong University, Xi'an, CN;

Inventors:

Laili Wang, Xi'an, CN;

Fengtao Yang, Xi'an, CN;

Wei Mu, Xi'an, CN;

Dingkun Ma, Xi'an, CN;

Cheng Zhao, Xi'an, CN;

Jianpeng Wang, Xi'an, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/50 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 23/50 (2013.01); H01L 23/36 (2013.01);
Abstract

Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.


Find Patent Forward Citations

Wang, Laili. (2022). Planar power module with spatially interleaved structure (U.S. Patent No. 11532557). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11532557

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…