The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Apr. 22, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kalyanjit Ghosh, Pleasanton, CA (US);

Shailendra Srivastava, Fremont, CA (US);

Tejas Ulavi, San Jose, CA (US);

Yusheng Zhou, Sunnyvale, CA (US);

Amit Kumar Bansal, Milpitas, CA (US);

Sanjeev Baluja, Campbell, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); B08B 7/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); G03F 7/42 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32495 (2013.01); H01J 37/32862 (2013.01); H01L 21/67017 (2013.01); B08B 7/0021 (2013.01); G03F 7/427 (2013.01); H01J 37/32834 (2013.01); H01L 21/67028 (2013.01); H01L 21/6831 (2013.01); H01L 21/68742 (2013.01);
Abstract

Implementations disclosed herein generally relate to systems and methods of protecting a substrate support in a process chamber from cleaning fluid during a cleaning process. The method of cleaning the process chamber includes positioning in the process chamber a cover substrate above a substrate support and a process kit that separates a purge volume from a process volume. The method of cleaning includes flowing a purge gas in the purge volume to protect the substrate support and flowing a cleaning fluid to a process volume above the cover substrate, flowing the cleaning fluid in the process volume to an outer flow path, and to an exhaust outlet in the chamber body. The purge volume is maintained at a positive pressure with respect to the process volume to block the cleaning fluid from the purge volume.


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