The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Jun. 30, 2021
Taiyo Yuden Co., Ltd., Tokyo, JP;
Yoshikazu Maruyama, Takasaki, JP;
Noriyuki Mabuchi, Takasaki, JP;
Ichiro Yokoyama, Takasaki, JP;
Masataka Kohara, Wakayama, JP;
Keiichi Nozawa, Wakayama, JP;
Masakazu Okazaki, Wakayama, JP;
Chikako Yoshida, Wakayama, JP;
Tomoyuki Oyoshi, Wakayama, JP;
Ikuo Kakiuchi, Wakayama, JP;
Masami Seto, Wakayama, JP;
TAIYO YUDEN CO., LTD., Tokyo, JP;
Abstract
An electronic component includes: an insulator part () of rectangular solid shape; a coil element () provided inside the insulator part (); bottom electrodes () provided on a bottom face () of the insulator part () and electrically connected to the coil element (); a plating layer () provided in a manner overlapping each bottom electrode () so that its end () on the bottom face () is away from the end () of the bottom electrode (); a plating layer () which is arranged between the bottom electrode () and the plating layer () and overlaps the bottom electrode (), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (); and an insulation layer () provided on the bottom face () in a manner covering the end () of the bottom electrode ().