The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Oct. 02, 2018
Applicant:

Interdigital Vc Holdings, Inc., Wilmington, DE (US);

Inventors:

Kangying Cai, Rennes, FR;

Joan Llach Pinsach, Cesson-Sevigne, FR;

Celine Guede, Cesson-Sevigne, FR;

Assignee:

InterDigital VC Holdings, Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 17/00 (2006.01); G06T 7/90 (2017.01);
U.S. Cl.
CPC ...
G06T 17/00 (2013.01); G06T 7/90 (2017.01); G06T 2207/10028 (2013.01); G06T 2210/56 (2013.01);
Abstract

This method for hole filling of a point cloud having at least one hole comprises:—detecting () boundary points of the point cloud;—grouping () the detected boundary points in boundary regions based on their spatial adjacency;—covering () each boundary region with at least one plane; and—inserting () new points in the point cloud using the planes covering the boundary regions.


Find Patent Forward Citations

Cai, Kangying. (2022). Method and device for hole filling of a point cloud (U.S. Patent No. 11532120). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11532120

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…