Stacked neuromorphic devices and neuromorphic computing systems

Abstract

A stacked neuromorphic device includes a logic die including a control circuit and configured to communicate with a host, and core dies stacked on the logic die and connected to the logic die via through silicon vias (TSVs) extending through the core dies. The core dies include a neuromorphic core die including a synapse array connected to row lines and column lines. The synapse array includes synapses configured to store weights and perform a calculation based on the weights and input data. The weights are included in layers of a neural network system. And the control circuit provides the weights to the neuromorphic core die through the TSVs and controls data transmission by the neuromorphic core die.