The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

May. 30, 2018
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Kazuhiro Hongo, Kanagawa, JP;

Takaaki Hirano, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/367 (2020.01); G01N 3/08 (2006.01); G01N 3/32 (2006.01);
U.S. Cl.
CPC ...
G06F 30/367 (2020.01); G01N 3/08 (2013.01); G01N 3/32 (2013.01); G01N 2203/0066 (2013.01); G01N 2203/0073 (2013.01); G01N 2203/0214 (2013.01);
Abstract

The present disclosure relates to an information processing device, an information processing method, and a program for enabling more accurate prediction of a crack to be made. A model acquisition unit acquires a structure model Mfrom a model generation unit, an external device (not illustrated), or the like. Amplitude load energy A in an element Ehaving no cracks is set on the basis of a relationship between an equivalent stress σ and an equivalent elastic strain ε experimentally obtained according to a material constituting the element E. Since the equivalent elastic strain ε depends on a crack variable φ, the amplitude load energy A is expressed as a function of the crack variable φ. A crack prediction unit predicts a crack to be generated in a structure D by calculating a differential equation having a term proportional to the amplitude energy. The present disclosure can be applied to, for example, a crack prediction device that predicts a crack.


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