The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Jul. 25, 2018
Applicant:

Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., Munich, DE;

Inventors:

Hans-Joachim Quenzer, Itzehoe, DE;

Ulrich Hofmann, Itzehoe, DE;

Vanessa Stenchly, Meldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/08 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G02B 26/10 (2006.01);
U.S. Cl.
CPC ...
G02B 26/0833 (2013.01); B81B 7/0067 (2013.01); B81C 1/00317 (2013.01); B81B 2201/042 (2013.01); B81C 2203/0109 (2013.01); G02B 26/10 (2013.01); G02B 26/105 (2013.01);
Abstract

The invention relates to a MEMS mirror assembly for detecting a large angular range up to 180°, preferably up to 160°, and to a method for producing a MEMS mirror assembly. The mirror assembly comprises a carrier substrate (), on which a mirror () vibrating about at least one axis is mounted, a transparent cover (), which is connected in a hermetically sealed manner to the carrier substrate () and which comprises an ellipsoidal dome () having a substantially round base area, and a compensation optical system (), which is arranged in a predefined beam path for an incident beam outside the dome (). The middle of the mirror () lies in the centre point of the dome, and the compensation optical system () collimates the incident beam in such a way that a divergence or convergence of the beam caused by the boundary surfaces of the dome once said beam has exited from the dome () is substantially compensated. The MEMS mirror assemblies are produced by joining a cover wafer and a mirror wafer, which each comprise a plurality of hemispherical domes and mirrors mounted on the carrier substrate. The mirror assemblies are then separated from the joined wafers. The domes of the cover wafer are produced by a glass flow process.


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