The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Feb. 22, 2021
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Wan-Ling Huang, Miao-Li County, TW;

Tzu-Yuan Lin, Miao-Li County, TW;

Geng-Fu Chang, Miao-Li County, TW;

Chun-Hsien Lin, Miao-Li County, TW;

Shu-Ming Kuo, Miao-Li County, TW;

Jui-Feng Ko, Miao-Li County, TW;

Tsau-Hua Hsieh, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20963 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 5/0021 (2013.01); H05K 7/20509 (2013.01); H05K 7/20972 (2013.01); H05K 2201/10128 (2013.01);
Abstract

An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.


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