The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Jan. 12, 2021
Applicant:
Samsung Display Co., Ltd., Yongin-si, KR;
Inventors:
Jungseon Park, Cheonan-si, KR;
Taeyoung Park, Asan-si, KR;
Jun-Hee Lee, Seoul, KR;
Hyunwoo Lee, Seongnam-si, KR;
Assignee:
Samsung Display Co., Ltd., Yongin-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/103 (2013.01); H05K 3/323 (2013.01); H05K 2203/1105 (2013.01);
Abstract
A bonding device includes: a bonding head configured to move in a vertical direction; a stage disposed under the bonding head and including a first portion, the first portion having a first plane surface facing the bonding head and a first support surface opposite to the first plane surface; and a supporter disposed under the stage and including a second support surface facing the first support surface, wherein the second support surface of the supporter has a recess portion having a first radius of curvature.