The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Mar. 07, 2019
Applicants:

Dong-man Kim, Seoul, KR;

Chongqing Xinping Semiconductor Co., Ltd., Chongqing, CN;

Inventor:

Dong-Man Kim, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 9/06 (2006.01); H04R 9/04 (2006.01); H01F 7/02 (2006.01); H01F 7/08 (2006.01); H04R 1/06 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H04R 9/046 (2013.01); H01F 7/02 (2013.01); H01F 7/081 (2013.01); H04R 1/06 (2013.01); H04R 9/047 (2013.01); H04R 9/06 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01);
Abstract

The present invention relates to a hybrid movable coil plate and a flat panel speaker, and more particularly, to a hybrid movable coil plate and a flat panel speaker which have improved acoustic pressure of the speaker by attaching a coil pattern printed on one surface of the movable coil plate and a copper wire coil wound on the other surface to increase inductive electromotive force. A hybrid movable coil plate for a flat panel speaker is characterized by including a spirally wound copper wire coil attached on one surface thereof and a PCB coil pattern-printed on the other surface thereof, wherein the copper wire coil and the PCB coil are formed in track shapes, a pair of lead wire connection ends are formed, and copper foils are formed in one or more via holes for electrical connection between the copper wire coil and the PCB coil, and in the vicinity of at least one among the one or more via holes.


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