The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Mar. 24, 2021
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Naoya Matsumoto, Nagaokakyo, JP;

Takayuki Shinozaki, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/04 (2006.01); H04B 1/03 (2006.01);
U.S. Cl.
CPC ...
H04B 1/0475 (2013.01); H04B 1/03 (2013.01); H04B 1/0483 (2013.01); H04B 2001/0408 (2013.01);
Abstract

A radio frequency module includes a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board. An aspect of such a radio frequency module is that it is possible to achieve a compact form factor, although still provide RF transmit and receive capability. The RF module also includes external-connection terminals and a LNA, and the first semiconductor device and the low noise amplifier are disposed on mutually opposite surfaces of the module board.


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