The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Jun. 01, 2020
Applicant:

Teco Electric & Machinery Co., Ltd., Taipei, TW;

Inventors:

Lian-Shin Hung, Taipei, TW;

Ming-Te Ho, Taipei, TW;

Pi-Jen Hsieh, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 5/18 (2006.01); H02K 9/04 (2006.01); H02K 5/20 (2006.01);
U.S. Cl.
CPC ...
H02K 5/18 (2013.01); H02K 5/20 (2013.01); H02K 9/04 (2013.01);
Abstract

A heat-dissipation frame assembly includes a motor frame, an air-guide shield and an airflow-driving device. The motor frame includes a main frame and annular heat-dissipation fins. Each of the annular heat-dissipation fins has an outer edge, and an average radial distance is defined between the outer edge and the central axis. The average radial distances of the annular heat-dissipation fins are decreased gradually in the longitudinal direction from the first end portion to the second end portion, and an external annular channel is formed between any neighboring two annular heat-dissipation fins. The airflow-driving device, disposed at the second end portion of the main frame, is used for generating at least one heat-dissipating airflow. The air-guide shield, connected with the motor frame, surrounds and covers the plurality of annular heat-dissipation fins, such that the at least one heat-dissipating airflow is guided into the plurality of external annular channels.


Find Patent Forward Citations

Hung, Lian-Shin. (2022). Heat-dissipation frame assembly (U.S. Patent No. 11527936). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11527936

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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