The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Jul. 12, 2019
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhen Zhang, Beijing, CN;

Yuqing Yang, Beijing, CN;

Yue Wei, Beijing, CN;

Yiyang Zhang, Beijing, CN;

Lei Deng, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 27/3258 (2013.01); H01L 51/0096 (2013.01); H01L 51/5206 (2013.01); H01L 2227/323 (2013.01);
Abstract

A display substrate and a preparation method thereof, and a display device are provided. The preparation method includes: forming a display region and a non-display region including an opening region; forming a first barrier wall between the display region and the opening region, in which the first barrier wall surrounds the opening region and includes a first metal layer structure, and a recess is formed on at least one side surface, surrounding the opening region, of the first metal layer structure; and after the first barrier wall is formed, forming a conductive layer pattern in the display region and on the first barrier wall. The forming the conductive layer pattern includes: forming a conductive material layer in the display region and on the first barrier wall, the conductive material layer being disconnected at the first barrier wall; and patterning the conductive material layer to form the conductive layer pattern.


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