The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
May. 08, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Taehyeun Ha, Suwon-si, KR;
Jaehoo Park, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 25/075 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); B29C 45/14065 (2013.01); B29C 45/1671 (2013.01); H01L 25/0753 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/3475 (2013.01); H01L 2933/005 (2013.01);
Abstract
A method for molding a display module includes forming a cavity using a die plate of a first die and a plurality of side surface dies; filling the cavity with a coating material; fixing the display module to a second die using a coupling body disposed on a second surface of the display module, opposite of a first surface of the display module disposed with a plurality of LEDs; soaking the display module in the coating material filled in the cavity; curing the coating material; and separating the cured coating material of the display module from the die plate.