The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Aug. 27, 2021
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Yuichi Yamada, Itano-gun, JP;

Takeshi Tamura, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 25/075 (2006.01); G02F 1/13357 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); G02F 1/133603 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A method of manufacturing a light emitting device includes: providing a first member comprising: a base, a plurality of phosphor frames positioned on the base, the plurality of phosphor frames including a first phosphor frame and a second phosphor frame that is adjacent to the first phosphor frame, and a light transmissive member, a portion of which is disposed between the first phosphor frame and the second phosphor frame; disposing a first light emitting element in the first phosphor frame and a second light emitting element in the second phosphor frame, wherein: each light emitting element has an emission face and an electrode forming face located opposite to the emission face, each light emitting element comprises an electrode located on its electrode forming face, and each light emitting element is disposed such that its emission face faces the base; and cutting the light transmissive member.


Find Patent Forward Citations

Loading…