The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Nov. 09, 2020
Applicant:
The Aerospace Corporation, El Segundo, CA (US);
Inventors:
Eric Joseph Nemanick, Santa Monica, CA (US);
Yao Y. Lao, Irvine, CA (US);
Assignee:
THE AEROSPACE CORPORATION, El Segundo, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0669 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 2224/85048 (2013.01);
Abstract
Interconnects may be formed to an electronic device by creating a strong bond between a wire or lead, one or more nanomaterials, and a contacting area on the electronic device. The creating of the strong bond comprises triggering low power air plasma to activate a surface of the one or more nanomaterials forcing the one or more nanomaterials to bond to the surface of the contacting area.