The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Aug. 26, 2020
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Yu-Chieh Chou, New Taipei, TW;

Tsung-Hsiang Lin, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/267 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0619 (2013.01); H01L 29/267 (2013.01); H01L 29/408 (2013.01); H01L 29/66431 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a substrate; a buffer layer on the substrate; a channel layer on the buffer layer; a barrier layer on the channel layer; a doped compound semiconductor layer on a portion of the barrier layer; an un-doped first capping layer on the doped compound semiconductor layer; a gate structure on the un-doped first capping layer; and source/drain structures on opposite sides of the gate structure. There is a channel region in the channel layer that is adjacent to the interface between the channel layer and the barrier layer.


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