The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Jan. 19, 2021
Interface Technology (Chengdu) Co., Ltd., Sichuan, CN;
Interface Optoelectronics (Shenzhen) Co., Ltd., Guangdong, CN;
General Interface Solution Limited, Miaoli County, TW;
Chia-Ming Fan, Guangdong, CN;
Po-Lun Chen, Guangdong, CN;
Chun-Ta Chen, Guangdong, CN;
Po-Ching Lin, Guangdong, CN;
Ya-Chu Hsu, Guangdong, CN;
Chien-Yu Huang, Guangdong, CN;
Ping-Hsiang Kao, Guangdong, CN;
Interface Technology (ChengDu) Co., Ltd., Sichuan, CN;
Interface Optoelectronics (ShenZhen) Co., Ltd., Guangdong, CN;
General Interface Solution Limited, Miaoli County, TW;
Abstract
A micro light-emitting diode (micro LED) display and a package method thereof are described. The micro LED display includes a substrate, various micro LED chips, and an encapsulation film. The substrate includes a wire. The micro LED chips are disposed on a surface of the substrate and are electrically connected to the wire. A light-emitting surface of each of the micro LED chips is set with at least one micro structure, and each micro structure has a top end. The encapsulation film encapsulates the micro LED chips, and covers the surface of the substrate. The top ends of the micro structures are located in a light-emitting surface of the encapsulation film.