The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Apr. 10, 2019
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventors:
Takahiro Igarashi, Kanagawa, JP;
Shusaku Yanagawa, Kanagawa, JP;
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01L 23/66 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/552 (2013.01); H01L 24/32 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/32265 (2013.01);
Abstract
A module of an embodiment of the present disclosure includes a first substrate including a first wiring pattern and a second substrate having a second wiring pattern with a wiring density different from that of the first wiring pattern, in which the second substrate is bonded to the first substrate. At least one of the first substrate or the second substrate has visible light transmittance.