The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Apr. 20, 2021
Applicant:

Ntrium Inc., Hwaseong-si, KR;

Inventors:

Se Young Jeong, Hwaseong-si, KR;

Kisu Joo, Hwaseong-si, KR;

Kyu Jae Lee, Hwaseong-si, KR;

Seungjae Lee, Hwaseong-si, KR;

Assignee:

Ntrium Inc., Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 21/78 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.


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