The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Aug. 31, 2020
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventor:
Yuichi Sano, Tokyo, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49822 (2013.01); H01L 24/32 (2013.01); H01L 25/18 (2013.01); H01L 2224/32225 (2013.01);
Abstract
A semiconductor device includes: a multilayer wiring substrate including a plurality of wiring layers; a first semiconductor chip disposed on the wiring substrate; and a bonding layer bonding the first semiconductor chip to the wiring substrate. A trace formed on the wiring substrate includes a first trace width portion and a second trace width portion, a width of the first trace width portion being greater than the second trace width portion.