The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Nov. 24, 2017
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Yoshinori Matsuura, Ageo, JP;
Tetsuro Sato, Ageo, JP;
Takenori Yanai, Ageo, JP;
Toshimi Nakamura, Ageo, JP;
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Abstract
There is provided a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet having openings on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween; contacting or infiltrating the soluble adhesive layer with a liquid capable of dissolving the soluble adhesive layer through the openings to thereby dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the position of the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced so as to generate no large local warpage, thereby improving the reliable connection in the multilayer wiring layer and the flatness (coplanarity) on the surface of the multilayer wiring layer. The reinforcing sheet having finished its role can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.