The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Feb. 03, 2022
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Cherngye Hwang, San Jose, CA (US);

Reimar Azupardo, Santo Tomas Batangas, PH;

Randall Simmons, San Jose, CA (US);

Mary Agnes Gupit Perez, Paranaque, PH;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 14/06 (2006.01); C23C 14/54 (2006.01); C23C 14/32 (2006.01); G11B 5/85 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32614 (2013.01); C23C 14/0611 (2013.01); C23C 14/325 (2013.01); C23C 14/542 (2013.01); G11B 5/85 (2013.01); H01J 37/3255 (2013.01); H01J 37/32064 (2013.01);
Abstract

Cathode structures are disclosed for use with pulsed cathodic arc deposition systems for forming diamond-like carbon (DLC) films on devices, such as on the sliders of hard disk drives. In illustrative examples, a base layer composed of an electrically- and thermally-conducting material is provided between the ceramic substrate of the cathode and a graphitic paint outer coating, where the base layer is a silver-filled coating that adheres to the ceramic rod and the graphitic paint. The base layer is provided, in some examples, to achieve and maintain a relatively low resistance (and hence a relatively high conductivity) within the cathode structure during pulsed arc deposition to avoid issues that can result from a loss of conductivity within the graphitic paint over time as deposition proceeds. Examples of suitable base material compounds are described herein where, e.g., the base layer can withstand temperatures of 1700° F. (927° C.).


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