The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Jun. 18, 2019
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Retsu Tahara, Nagaokakyo, JP;

Tomohiro Kageyama, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01);
U.S. Cl.
CPC ...
H01G 4/38 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer ceramic electronic component includes multilayer ceramic electronic component bodies which each include a multilayer body and first and second outer electrodes provided on both end surfaces of the multilayer body. The multilayer ceramic electronic component also includes a first metal terminal connected to the first outer electrodes and a second metal terminal connected to the second outer electrodes. Each multilayer ceramic electronic component body includes a dimension in a lamination direction that is less than a dimension in a width direction, and is positioned so that one of the first and second side surfaces faces a mounting surface. The first and second metal terminals extend between the first and second outer electrodes of the multilayer ceramic electronic component bodies. The multilayer bodies, first and second outer electrodes, and at least portions of the first and second metal terminals are covered by a cover material.


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