The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Apr. 29, 2021
Applicant:

Luxvisions Innovation Limited, New Territories, HK;

Inventor:

Cheng-Te Tseng, New Territories, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 5/02 (2021.01); G02B 27/64 (2006.01); G02B 7/04 (2021.01); G03B 5/00 (2021.01); G03B 13/32 (2021.01); H04N 5/225 (2006.01); H04N 5/232 (2006.01); H02K 41/035 (2006.01);
U.S. Cl.
CPC ...
G02B 7/04 (2013.01); G02B 27/646 (2013.01); G03B 5/00 (2013.01); G03B 5/02 (2013.01); G03B 13/32 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/23287 (2013.01); G03B 2205/0007 (2013.01); G03B 2205/0069 (2013.01); H02K 41/0356 (2013.01);
Abstract

An imaging apparatus includes an image sensor assembly and a plurality of signal feed-in contacts. The image sensor assembly includes a movable substrate, an image sensing chip, and a bearing frame. The image sensing chip is disposed on an upper surface of the movable substrate. The bearing frame is disposed on the upper surface and surrounds the image sensing chip. The signal feed-in contacts are disposed on the movable substrate, and the signal feed-in contacts are not shaded by the image sensor assembly. The signal feed-in contacts are configured to transmit an enabling signal for enabling the image sensing chip.


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