The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Sep. 16, 2019
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Sebastian Meier, Munich, DE;
Heinrich Wachinger, Helfenbrunn, DE;
Bernhard Peter Lange, Freising, DE;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 33/18 (2006.01); G01N 27/07 (2006.01); G01N 27/08 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G01N 33/1886 (2013.01); G01N 27/07 (2013.01); G01N 27/08 (2013.01); G01N 33/1893 (2013.01); H01L 21/6715 (2013.01);
Abstract
In examples, a method of manufacturing a fluid sensing package comprises coupling a semiconductor die to a first set of conductive terminals; positioning the semiconductor die within a socket, a fluid probe extending through a probe orifice in a lid of the socket; positioning a ring of the fluid probe on a fluid sensing portion of the semiconductor die by closing the lid of the socket; and using the fluid probe to apply fluid to an area of the fluid sensing portion circumscribed by the ring.