The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Nov. 18, 2020
Applicant:

Hp Indigo B.v., Amstelveen, NL;

Inventors:

Matan Schneider, Ness Ziona, IL;

Eli Shoshani, Ness Ziona, IL;

Fernanda Orlik, Ness Ziona, IL;

Assignee:

HP Indigo B.V., Amstelveen, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/04 (2006.01); G03G 15/00 (2006.01); G03G 15/10 (2006.01);
U.S. Cl.
CPC ...
G01N 27/048 (2013.01); G03G 15/6558 (2013.01); G03G 15/6588 (2013.01); G03G 15/10 (2013.01); G03G 15/5025 (2013.01); G03G 2215/00763 (2013.01); G03G 2215/00776 (2013.01); G03G 2215/00801 (2013.01);
Abstract

Apparatus and methods are provided for measuring the dryness of primer on a substrate in an inline priming system. In implementations, the apparatus comprises a plurality of measurement electrodes spaced laterally to extend across and contact a primed surface of a substrate following application of a primer to the substrate as it is fed through the inline priming system. A resistance measurement unit is provided as part of the dryness measuring apparatus to, in use, measure the surface resistance of the primed substrate between different measurement electrodes across the primed surface of a substrate. A controller is provided in the dryness measurement apparatus, the controller arranged to, in use: receive the measured surface resistance value and to generate, based on the measured surface resistance values, a dryness profile indicative of the dryness of the primer at locations across the substrate in the direction of the spacing of the electrodes.


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