The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Oct. 21, 2016
Applicants:

Toyo Kohan Co., Ltd., Tokyo, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Teppei Kurokawa, Kudamatsu, JP;

Yusuke Hashimoto, Kudamatsu, JP;

Hironao Okayama, Kudamatsu, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B23K 20/02 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); C22F 1/08 (2006.01); C30B 25/18 (2006.01); C30B 29/02 (2006.01); C30B 1/02 (2006.01); H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
B32B 15/015 (2013.01); B23K 20/023 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C22F 1/08 (2013.01); C30B 1/02 (2013.01); C30B 25/18 (2013.01); C30B 29/02 (2013.01); H01L 39/2454 (2013.01);
Abstract

It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0and I0, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2and I2, respectively, I0<20%, I2=70 to 90%, and I0<20%, I2=70 to 90% and I0−I0<13%.


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