The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Sep. 10, 2020
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Hidefumi Nakamura, Aomori, JP;
Atsushi Nakamura, Aomori, JP;
Toshiki Sano, Aomori, JP;
Naoko Shima, Nagano, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/14 (2021.01); B22F 3/10 (2006.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); B33Y 70/10 (2020.01); B22F 1/05 (2022.01); B22F 1/10 (2022.01); B33Y 80/00 (2015.01); B22F 1/16 (2022.01);
U.S. Cl.
CPC ...
B22F 10/14 (2021.01); B22F 1/05 (2022.01); B22F 1/10 (2022.01); B22F 1/16 (2022.01); B22F 3/1021 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12);
Abstract
A powder for additive manufacturing, which is a powder to be used in a three-dimensional additive manufacturing method, including a plurality of coated particles containing metal particles, and resin coating films that cover the metal particles and contain a caking additive, wherein 0.0001≤t/D50≤0.0010 in which t is an average thickness of the resin coating films and D50 is an average particle diameter of the metal particles.