The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Nov. 16, 2020
Applicant:

Bizlink International Corporation, New Taipei, TW;

Inventors:

Hsin-Tuan Hsiao, New Taipei, TW;

Jui-Hung Chien, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01R 12/722 (2013.01);
Abstract

A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.


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