The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Sep. 28, 2018
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Kameron Isaiah Chambliss, Corning, NY (US);

Benedict Osobomen Egboiyi, Painted Post, NY (US);

Kevin Barry Reiman, Horseheads, NY (US);

Vitor Marino Schneider, Painted Post, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); H05K 5/03 (2006.01); C03C 3/097 (2006.01); C03C 4/18 (2006.01); C03B 27/012 (2006.01); H05K 5/00 (2006.01); C03C 21/00 (2006.01); C03C 23/00 (2006.01); C03C 3/083 (2006.01);
U.S. Cl.
CPC ...
H05K 5/03 (2013.01); C03B 27/012 (2013.01); C03C 3/097 (2013.01); C03C 4/18 (2013.01); C03C 21/002 (2013.01); C03C 23/007 (2013.01); H05K 5/0017 (2013.01); H05K 5/0086 (2013.01); C03C 3/083 (2013.01); C03C 2204/00 (2013.01);
Abstract

Glass-based articles are disclosed having a thickness in a range of from about 0.2 mm to about 4.0 mm, a first compressive stress layer extending from a first surface of the glass-based article to a first depth of compression that is in a range of from about 5% to about 20% of the thickness, a second compressive stress layer extending from a second surface of the glass-based article to a second depth of compression that is in a range of from about 5% to about 20% of the thickness, wherein the second surface is opposite the first surface, and a central region extending from the first depth of compression to the second depth of compression and having a maximum tensile stress in a range of from about 0.5 MPa to about 20 MPa. Electronic devices comprising the glass-based articles and methods of making glass-based articles are also disclosed.


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